Developed the capability for mass production of Multilayer Printed Circuit Board(PCB) for
semiconductor testing(ATE equipment) which can be applied to less than 15um of laminating registration.
(Star Company Promotion Project from Gyeonggi-Do) |
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Developed the mass production
technology for the semiconductor testing PCB which
below 0.4mm pitch with electro gold plating. (Cooperating
with Gyeonggi College of Science and technology.) |
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Developed the 0.35mm pitch SOC
TYPE MOTHER BOARD for semiconductor testing. (Cooperating
with Korea Polytechnic University) |
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Patent application:
Hyper multi-layer PCB and method for production
the hyper multi-layer PCB
(The application number: 10-2013-0119196) |
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Patent application:
Method for production hyper multi-layer using
pre-etching with conductive coating.
(The application number: 10-2013-0116341) |
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Developed multi-functional wiring
material for Superhigh frequency mobile package.(Cooperating
with Korean Institute of Industrial Technology
and Dong-Yang Ink.) |
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Patent application/Registration:
Riveting Machine and Control method for the riveting
machine
(The application number: 10-2012-0115344) |
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Patent application
- Shocking and oscillation facility for PCB.
(The application number: 10-2010-0127072) |
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Developed
Aspect Ratio over 26:1 Cu plating technology
for mass production. |
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Established
quality insurance and inspection system. |
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Developed a simulation program
to proceed 1.5um electro hard gold plating technology
for PCB. (Cooperating with Korea Polytechnic University) |
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